Empower TechnologiesT and Texas Instruments Streamline
Consumer Electronic Development

  Linux Kernel 2.6 and DSP/BIOST Link Support for OMAP5912 Dual-Core Processor Now Available in LDK5912 Development Kit

Richmond, British Columbia - July 12, 2006 - Simplifying the integration of Linux and DSP applications, Empower Technologies (Empower) and Texas Instruments Incorporated (TI) today announced the release of Empower's latest LinuxDA Embedded Operating System (LEOs 2.3) running Linux Kernel 2.6.12 along with TI's DSP/BIOST Link for TI's OMAP5912 dual-core digital signal processor (DSP) and ARM general purpose processor (GPP). For the first time the Linux Kernel 2.6.12 is available with the OMAP5912 and TI's latest software tools, such as DSP/BIOST Link, Code Composer StudioT Integrated Development Environment and Reference Framework 6 (RF6) so developers can create consumer electronics products at reduced cost, risk and time-to-market.

Available in the LDK5912 Development Kit, LEOs for TI's OMAP5912 dual-core processor with Linux Kernel 2.6.12 is the latest Linux operating software released by Empower. A complete development solution, Empower's LDK5912 comes with a flexible hardware board based on TI's OMAP5912 dual-core processor and solid software platform, making the kit ideal for applications that require high processing performance and long battery life in a feature rich, small package. Developers can use the LDK5912 to compile, download and test applications within minutes of set-up using the latest LEOs Linux kernel and TI's software tools offering.

The LDK5912 runs LEOs with Linux Kernel 2.6.12 and supports TI's latest DSP/BIOS Link version 1.3, DSP/BIOS real-time kernel and Code Composer Studio IDE for the OMAP5912. TI's DSP/BIOS Link 1.3, which is only available with LEOs, offers a unified and seamless interprocessor software interface between the ARM and DSP, improving memory management and enabling developers to easily integrate applications with DSP algorithms and software. This further simplifies development, messaging and pool application program interfaces (APIs) on the ARM to mirror those in DSP/BIOS 5.20 on the DSP. These unified APIs result in extremely efficient programming and interprocessor communication.

"The easy integration enabled by LEOs 2.3 on the LDK5912 will allow developers to efficiently design consumer electronics applications that are feature rich and truly differentiated," said Huy Pham, DSP SoC marketing manager, TI. "Empower continues to be a valuable member of the TI DSP Third Party Network and consistently delivers reliable, flexible solutions to customers."

The LDK5912 also comes with five sample WAV applications that are fully compatible with TI's RF6 version 3.1. WAV, or WAVE, (Waveform audio format ) is a Microsoft and IBM audio file format standard for storing audio on PCs. These applications demonstrate how easily LEOs and DSP/BIOS Link can interact with DSP codecs to leverage the processing performance of TI's OMAP5912 dual-core processor. Additionally, documentation shows developers how to create and download DSP codecs for their own custom device applications using an available JTAG interface and Code Composer Studio IDE. The LDK5912 running LEOs offers the advantage of supporting multiple programs and algorithms that are optimized for TI's TMS320C55xT DSP generation. This robust functionality reduces software development time and empowers designers to create cutting edge products by taking full advantage of the performance of TI's OMAP5912 dual-core processor.

"We are very excited to be able to deliver an out-of-the box embedded Linux solution in LEOs 2.3 for consumer electronics developers and wireless device manufacturers. This latest accomplishment by Empower's engineering team is impressive and solid proof of our software strength," said Paul Leung , President and CEO of Empower Technologies.

LDK5912 Specifications

The LDK5912 is currently available for $1,800 USD at www.empowertechnologies.com.

About the Texas Instruments DSP Third Party Network

Empower Technologies is a member of the TI DSP Third Party Network, a worldwide organization of independent companies that offer products and services supporting TI DSPs. As solution facilitators, TI third parties provide expertise across a variety of applications including audio, broadband, control, military, networking, optical networking, security, telecom, video and imaging, voice processing and wireless communications. Third party products and services include a broad range of application software, development hardware and software, and consulting services that help customers increase development efforts and accelerate time-to-market. For more information about the TI DSP Third Party Network, please visit http://www.ti.com/3p.

About Empower Technologies™

Founded in 2000, Empower Technologies (TSX.V: EPT) is an innovative company that brings the power and flexibility of the LEOs® (LinuxDAT Embedded Operating System) to the dynamic embedded computing Industry and the emerging Intelligent Appliance Market, through their development of Linux-based operating software, embedded system technologies and solutions.

The products and services that form the base of its business activities include an embedded system development platform for LEOs®, based on Texas InstrumentsT embedded CPU platform, that fulfill the needs and demands of developers and the embedded computing Industry. Empower is continuing to develop LEOs® and newer versions of embedded CPUs in line with Texas InstrumentsT.

By uniting top professionals from within the computer industry and developing quality partnerships and strategic alliances, Empower is committed to being the leading developer of Linux-based operating software and embedded system technologies and solutions for electronics manufacturers and developers.

Empower's brands are "LEOs®", "LinuxDAT", Linux-based embedded operating systems and "PowerPlayT", smart consumer electronics.

Contact Information:

Media Enquiries:
Paul Leung - Chairman, President and CEO: pcleung@empowertechnologies.com or via Tel @ (604) 278-3100
Investor Relations: investorline@empowertechnologies.com
More Information on Empower Technologies: www.empowertechnologies.com
Sales Enquiries: sales@empowertechnologies.com or via Tel @ (604) 278-3100

Paul Leung
Chairman, President and CEO

Empower Technologies Corporation
# 405-5600 Parkwood Way
Crestwood Commerce Centre
Richmond , BC , Canada V6V 2M2

The statements contained in this news release that are not historical facts are forward looking statements.  Such statements are based on management's estimates, assumptions and projections using available information.  The company cautions that actual financial results could differ materially from the current expectations due to a number of factors.

The TSX Venture Exchange has in no way passed upon the merits of the proposed transactions and has neither approved nor disapproved the contents of this press release.

Empower Technologies, LEOs, PowerPlay and LinuxDA are the trademarks of Empower Technologies, Inc. All other brands are trademarks of their respective owners.